KIERO LINK - Light-Cured Metal- Resin Bonding with opaquer - Framework, clasp and implant-retained structure

Kiero Link guarantees a permanent bond and outstanding adhesion values in the case of compressive, shearing and tensile loads. Edge gap clearance. No thermal load on the metal framework. Polymerisable in every high or low-performance light-emitting device (320-400 nm).

Indicaciones

* Free choice of alloy and resin

* No dissolution of the opaque by the monomer

* Individualised opaque application