16.–20.03.2027 #IDScologne

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EN Bond Plus SE SINGLE COMPONENT, SELF-ETCH DENTAL ADHESIVE | Exhibitor on the IDS - International Dental Show 2025 Bond Plus SE SINGLE COMPONENT, SELF-ETCH DENTAL ADHESIVE | Exhibitor on the IDS - International Dental Show 2025 DE

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Bond Plus SE SINGLE COMPONENT, SELF-ETCH DENTAL ADHESIVE | Exhibitor on the IDS - International Dental Show 2025

Bond Plus SE SINGLE COMPONENT, SELF-ETCH DENTAL ADHESIVE

Description
SINGLE COMPONENT, SELF-ETCH DENTAL ADHESIVE
Simplified ultra-efficient bonding system based on proven ethanol/water solvent technology
Total etch, less technique sensitive
Ideal for wet or dry bonding
Reduced post-operative sensitivity
Filler Loaded
Reduced micro-leakage
Reduced film thickness
Increased bond strength
One bottle for ultimate simplicity of use
Time saving
For direct & indirect applications
Reliable: clinically proven
 
Core-Technologies
Optimal filler load (15%)
TSoloetch
Ethanol/water solvent system
Available-in
Ref No :
Available-in
4003
5ml Liquid
Logo
Woodlands Road 10
BUSHEY WD23 2LR
United Kingdom
Hall 11.3 | D060 E061